Solder powder
High-Quality Solder Powder for Precision Soldering Applications
Solder powder is a critical material in electronics manufacturing, PCB assembly, and various industrial applications. Our premium solder powder is engineered to deliver consistent performance, excellent flow characteristics, and reliable bonding strength.
Key Product Specifications:
- Material Composition: Available in Sn63/Pb37, Sn96.5/Ag3.0/Cu0.5 (SAC305), and other customized alloys
- Particle Size Distribution: Range from Type 1 (75-150μm) to Type 6 (2-11μm)
- Melting Point: Varies according to alloy composition (183°C for Sn63/Pb37, 217-220°C for SAC305)
- Oxide Content: <0.1% by weight
- Appearance: Free-flowing spherical powder with uniform particle shape
Technical Parameters Table
| Parameter | Specification | Testing Method |
|---|---|---|
| Alloy Composition | ±0.2% of nominal value | ICP-OES |
| Particle Size (D50) | 25-45μm (can be customized) | Laser Diffraction |
| Apparent Density | 3.5-4.5 g/cm³ | Hall Flowmeter |
| Tap Density | 4.5-5.5 g/cm³ | ASTM B527 |
| Oxidation Rate | <0.3% weight gain after 24h at 25°C/60%RH | Thermogravimetric Analysis |
Solder Powder FAQs
What is the shelf life of solder powder?
Our solder powder has a standard shelf life of 12 months when stored in its original unopened packaging under recommended conditions (temperature below 25°C, relative humidity below 60%). Once opened, we recommend using the product within 6 months and storing it in a nitrogen-filled container to minimize oxidation. The actual shelf life may vary depending on specific alloy composition and particle size.
How does solder powder particle size affect soldering performance?
Particle size significantly impacts solder paste rheology and printing performance. Finer powders (Type 4-6) enable better resolution for fine-pitch components but may oxidize faster. Coarser powders (Type 1-3) offer better slump resistance but may not suit ultra-fine pitch applications. For most SMT applications, Type 3 (25-45μm) or Type 4 (20-38μm) solder powder provides the optimal balance between printability and reliability.
What safety precautions should be taken when handling solder powder?
Always wear appropriate PPE including nitrile gloves, safety goggles, and dust masks when handling solder powder. Work in well-ventilated areas and avoid creating dust clouds. Lead-containing alloys require additional precautions - wash hands thoroughly after handling and never eat or drink in the work area. For lead-free alloys, still exercise caution as metal fumes from soldering may contain other potentially harmful elements.
Applications of Our Solder Powder
- Solder paste formulation for SMT assembly
- Wave soldering bath maintenance
- Brazing and repair applications
- 3D printing of conductive patterns
- Specialized coatings and composites
Packaging Options
| Package Type | Capacity | Special Features |
|---|---|---|
| Vacuum-sealed bags | 500g, 1kg | Nitrogen flushed for maximum freshness |
| Plastic bottles | 100g, 250g | Convenient for lab-scale use |
| Bulk containers | 5kg, 10kg, 25kg | Economical for high-volume users |
Our solder powder undergoes rigorous quality control testing including chemical composition analysis, particle size distribution measurement, and solder ball test to ensure batch-to-batch consistency. We offer technical support to help you select the optimal solder powder for your specific application requirements.